Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 860, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2020.158494
Keywords
Ag-CuO; Selective laser melting; Arc erosion; Contact materials
Categories
Funding
- National Natural Science Foundation of China [51607132, 51807069, 52007137]
- Natural Science Foundation of Shaanxi Province [2019-JQ-842]
- Graduate Scientific Innovation Fund for Xi'an Polytechnic University [chx2020036]
Ask authors/readers for more resources
This paper investigates the microstructure characteristics, mechanical properties, and arc erosion behavior of Ag-CuO materials prepared by SLM, showing that they exhibit excellent self-repairing characteristics and are suitable for low voltage devices.
In this paper, selective laser melting (SLM) was employed to fabricate the Ag-CuO electrical contact materials with high energy ball milled Ag-CuO composites powders. Microstructure characteristics and arc erosion behaviors of the Ag-CuO material prepared by SLM were investigated. Vickers microhardness and conductivity tests were conducted to determine the mechanical properties of the samples. The make-andbreak testing was carried out to determine the arc erosion behavior of the samples. The experimental results prove that the conductivity and microhardness change little after conducting make-and-break experiments and meet the need for low voltage devices. It was found that the SLM process will produce the holes and cracks of the Ag-CuO sample. However, the SLM Ag-CuO samples show excellent self-repairing characteristics. With the increase of the make-and-break testing, the flow of silver molten pool enhances and repairs the holes and cracks of SLM Ag-CuO samples. Meanwhile, the anti-arc erosion performance was improved during the flow of the arc eroded molten pool enhances. The current research demonstrated that the SLM Ag-CuO samples exhibit potential as electrical contact materials, which will also provide a new idea for the development of contact materials processing. (C) 2020 Elsevier B.V. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available