Fast seamless joining of SiCw/Ti3SiC2 composite using electric field-assisted sintering technique

A pair of Ti3SiC2 reinforced with SiC whiskers (SiCw/Ti3SiC2) composites was successfully joined without any joining materials using electric field-assisted sintering technology at a temperature as low as 1090 degrees C (T-i) and a short time of 30 s. The microstructure and mechanical properties of the obtained SiCw/Ti3SiC2 joints were investigated. The solid-state diffusion was the main joining mechanism, which was facilitated by a relatively high current density (similar to 586 A/cm(2)) at the joining interface. The shear strength of the sample joined at 1090 degrees C was 51.8 +/- 2.9 MPa. The sample joined at 1090 degrees C failed in the matrix rather than at the interface, which confirmed that a sound inter-diffusion bonding was obtained. A rapid and high efficient self-joining process may find application in the case of SiCw/Ti3SiC2 sealing cladding tube and end cap.

Automated summary

Using electric field-assisted sintering technology, a pair of SiC whiskers (SiCw) reinforced Ti3SiC2 (SiCw/Ti3SiC2) composites were successfully self-joined at a temperature as low as 1090 degrees C. The solid-state diffusion was the main joining mechanism, with a high current density facilitating the process. The shear strength of the joints reached 51.8 MPa, with failure occurring in the matrix rather than at the interface.