Journal
IEEE ELECTRON DEVICE LETTERS
Volume 42, Issue 4, Pages 569-572Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2021.3059639
Keywords
OFET; integration; common source amplifier; high sensitivity; bio-chemical chip
Categories
Funding
- Shanghai Science and Technology Commission [19JC1412400]
- NSFC of China [61674102, 61804094, 61974091]
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By using a through-plastic-via (TPV) three-dimensional (3D) integration approach, the organic field effect transistor (OFET) circuitry and sensing/reference electrodes (SE/RE) can be integrated for flexible bio-chemical sensor chips, improving signal amplification and noise suppression for weak ion response detection.
A through-plastic-via (TPV) three-dimensional (3D) integration approach is developed to integrate the organic field effect transistor (OFET) circuitry and the sensing/reference electrodes (SE/RE) for flexible bio-chemical sensor chips. Based on this approach, the SE can be fabricated using optimal processes on a different plastic substrate without concern of affecting the OFET part. Taking H+ detection as a proof-of-concept, it is demonstrated that a weak ion response (similar to 7 mV induced by 0.2 pH) is amplified by 10 times through an integrated OFET common source amplifier. With close integration of the OFET amplifier and the SE, external noise influence can also be suppressed, beneficial for improving signal-to-noise ratio and improving the detection limit.
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