Expansion of the Beamforming Coverage Area in an Elevation Plane for 60 GHz Band 3-D Beamforming

This letter proposes a novel antenna structure for 60 GHz band 3-D coverage beamforming. By using the proposed antenna structure, the coverage area can be expanded in an elevation plane. Dipole and patch subarray antennas were packaged into one structure by using the copper balls interconnection technique. A simple idea to utilize dipole and patch elements enables endfire and broadside radiations resulting in the coverage area expansion in the elevation plane. Two 2 x 4 array antennas were made up of eight multilayered substrate. Six metal layers were used for each multilayered substrate.

Automated summary

This letter introduces a novel antenna structure for 60 GHz band 3-D coverage beamforming, expanding the coverage area in an elevation plane. By packaging dipole and patch subarray antennas together using copper balls interconnection technique, the simple idea of utilizing dipole and patch elements enables endfire and broadside radiations, resulting in the expansion of coverage area in the elevation plane. Two 2 x 4 array antennas are made up of eight multilayered substrates, each with six metal layers.