4.7 Article

Synthesis and properties of transparent random and multi-block polyamide-imide films with high modulus and low CTE

Journal

EUROPEAN POLYMER JOURNAL
Volume 153, Issue -, Pages -

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.eurpolymj.2021.110512

Keywords

Coefficient of thermal expansion; Modulus; Transparency; Block copolymer; Polyamide-imides

Funding

  1. National Key R&D Program of China [2018YFA0209200]
  2. Key R&D Program of Shandong Province [2019TSLH0113]
  3. Key R&D Program of Zhejiang Province [2021C01126]
  4. Natural Science Foundation of Ningbo City, China [2019A610137]
  5. Science and Technology Innovation 2025 Major Project of Ningbo of China [2020Z051]

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Two new series of transparent polyamide-imides with high modulus and low coefficient of thermal expansion were synthesized by copolymerizing BPDA, TPC, and TFDB. The block copolymer PAI-3-B1 showed the best performance with high transparency, low CTE, and high tensile modulus.
Two new series of transparent polyamide-imides (PAIs) with high modulus and low coefficient of thermal expansion (CTE) were prepared by random or block copolymerization of 4,4'-biphthalic dianhydride (BPDA) and p-phthaloyl chloride (TPC) with 2,2'-bis(trifluoromethyl)benzidine (TFDB). These series of PAIs displayed low CTE of 16-42 ppm/K, good mechanical properties with high tensile modulus ranging from 4.9 to 6.6 GPa, tensile strengths of 112-170 MPa and elongations at break of 2.0-5.4%, as well as high transparency with transmittances at 500 nm (T-500nm) of 84-87%, which was greatly affected by the feed ratio of monomer BPDA & TPC, and the block length caused by block polymerization. The block copolymer PAI-3-B1 presented the best comprehensive performance with high transparency (T-500nm) of 87%, low CTE of 16 ppm/K and high tensile modulus of 6.1 GPa.

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