Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (T-max up to 451 degrees C), thermal conductivity (similar to 0.743 W/m.K), and high specific heat (5.364 J/g.K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 degrees C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

Automated summary

Novel polymers based on naturally available honokiol were fabricated to produce renewable and functional epoxy resins, showing excellent thermal stability, conductivity, high specific heat, dielectric properties, and low flammability. The high-performing networks have great potential applications in the electronics and microelectronics industry.