Journal
APPLIED PHYSICS LETTERS
Volume 118, Issue 20, Pages -Publisher
AIP Publishing
DOI: 10.1063/5.0045378
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Funding
- Defense Research and Development Organization (DRDO) under EP IPR 2018 [ERIP/ER/99011650/M/01/1739 (G)]
- Science and Engineering Research Board (SERB), Department of Science and Technology (DST), India [CRG/2020/005265]
- DST, India [IF180813]
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A novel binder less sputtering method is introduced for the growth of copper nitride nanoflakes incorporated into a composite electrode on flexible stainless steel substrate, resulting in outstanding electrochemical properties.
Here, we present a binder less sputtering approach for controllable growth of copper nitride (Cu3N) nanoflakes incorporated into 2D layered molybdenum disulfide (MoS2) nanoworms directly grown on flexible stainless steel (SS) substrate. The formation of the intermixed nanostructure is revealed by surface morphology. Moreover, the porous structure and good conductivity, and the presence of sulfur and N-2 edges facilitate the synergistic effect favor more pathways for insertion and desertion of electrolyte ions (Na+). The optimized composite electrode achieves an outstanding specific capacitance (215.47 F/g at 0.5 A/g) along with remarkable elongated cycle life (similar to 90% retention over 2000 cycles at 9.5 A/g). Additionally, the electrode (of dimensions 3 x 1 cm(2)) shows high energy density (similar to 30 Wh/kg at a power density of 138 W/kg), extended potential window (1 V), fair mechanical stability, and pliability (retains similar to 91% specific capacitance at 175 degrees bending angle). The contemporary method provides a cathode material for practically applicable supercapacitors with superior flexibility and desirable electrochemical properties.
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