Journal
ADVANCED FUNCTIONAL MATERIALS
Volume 31, Issue 23, Pages -Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.202100151
Keywords
encapsulation; light emitting diodes; organic solar cells; perovskite solar cells; stability
Categories
Funding
- National Natural Science Foundation of China [51672094, 51861145404, 51822203, 52002140, 21401167]
- Self-determined and Innovative Research Funds of HUST [2018KFYRCPY003, 2020kfyXJJS008]
- Natural Science Foundation of Hubei Province [ZRMS2020001132]
- Shenzhen Science and Technology Innovation Committee [JCYJ20180507182257563]
Ask authors/readers for more resources
Organic light emitting diodes, organic photovoltaics, and perovskite solar cells are vulnerable to degradation induced by moisture and oxygen, requiring robust encapsulation techniques with high barrier performance against these elements for protection. The advantages and disadvantages of various encapsulation technologies and materials, along with their applications in different devices, have been compared. Ongoing challenges and future perspectives in the field of encapsulation have also been addressed.
Organic light emitting diodes (OLEDs) employing organic thin-film based emitters have attracted tremendous attention due to their widespread applications in lighting and as displays in mobile devices and televisions. The novel thin-film photovoltaic techniques using organic or organic-inorganic hybrid materials such as organic photovoltaics (OPVs) and perovskite solar cells (PSCs) have become emerging competitive candidates with regard to the traditional photovoltaic techniques on account of high-efficiency, low-cost, and simple manufacturing processing properties. However, OLEDs, OPVs, and PSCs are vulnerable to the undesired degradation induced by moisture and oxygen. To afford long-term stability, a robust encapsulation technique by employing materials and structures that possess high barrier performance against oxygen and moisture must be explored and employed to protect these devices. Herein, the recent progress on specific encapsulation materials and techniques for three types of devices on the basis of fundamental understanding of device stability is reviewed. First, their degradation mechanisms, as well as, influencing factors are discussed. Then, the encapsulation technologies and materials are classified and discussed. Moreover, the advantages and disadvantages of various encapsulation technologies and materials coupled with their encapsulation applications in different devices are compared. Finally, the ongoing challenges and future perspectives of encapsulation frontier are provided.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available