4.7 Article

Real-time atomic-resolution observation of coherent twin boundary migration in CrN

Journal

ACTA MATERIALIA
Volume 208, Issue -, Pages -

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2021.116732

Keywords

Twins; In-situ high-resolution transmission electron microscopy; Twin boundary defect

Funding

  1. China Scholarship Council (CSC) [201608120053]
  2. MEYS CR [LM2018110]
  3. Austrian Science Fund (FWF) [P30341-N36, P 33696]
  4. Austrian Science Fund (FWF) [P30341] Funding Source: Austrian Science Fund (FWF)

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In this study, two different twin boundary defect nucleation and coherent twin boundary (CTB) migration modes were observed at different junctions in a binary transition-metal nitrides system. The study also revealed the asynchronous CTB migration mode and its associated atomic-scale dynamic and thermodynamic mechanisms. These findings provide new insights into the atomic-scale deformation mechanism in complex materials.
Although coherent twin boundary (CTB) migration in fcc metals has been widely studied, little is known about the CTB migration behavior in the binary transition-metal nitrides system (e.g. rock-salt CrN). Using in-situ atomic-resolution electron microscopy, we report two different twin boundary defect (TD) nucleation and CTB migration modes at the CTB/ITB (incoherent twin boundary) and CTB/surface junctions. A new twin defect nucleation and CTB migration mode are observed from the CTB/surface junction. We show that such CTB migration is associated with a boundary structure alternating from an N-terminated to Cr-terminated, involving Cr and N atom respective motion, i.e., asynchronous CTB migration. We further reveal the dynamic and thermodynamic mechanism of such asynchronous migration through strain analysis and DFT simulations. Our findings uncover an atomic-scale dynamic process of defect nucleation and CTB migration in a binary system, which provides new insight into the atomic-scale deformation mechanism in complex materials. (C) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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