4.8 Article

Microstructures in All-Inkjet-Printed Textile Capacitors with Bilayer Interfaces of Polymer Dielectrics and Metal-Organic Decomposition Silver Electrodes

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 13, Issue 20, Pages 24081-24094

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsami.1c01827

Keywords

e-textiles; inkjet printing; polymer dielectrics; MOD silver ink; interface behavior; flexible electronics

Funding

  1. VF Corporation
  2. Air Force Research Laboratory (AFRL)
  3. US National Science Foundation through Nanosystems Engineering Research Center for Advanced Self-Powered Systems for Integrated Sensors and Technologies [EEC 1160483]
  4. State of North Carolina and the National Science Foundation [ECCS-1542015]
  5. US Department of Defense (DoD)

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The study demonstrates the successful fabrication of an all-inkjet-printed textile capacitor using a multilayered structure of bilayer polymer dielectrics and particle-free metal-organic decomposition (MOD) silver electrodes. Understanding the porous/anisotropic microstructure of textiles and their surface energy relationship is crucial for successful planarization. The unique chemical interaction at the interfaces of bilayer dielectrics plays a significant role in insulating porous textile substrates and improving chemical and mechanical durability.
Soft printed electronics exhibit unique structures and flexibilities suited for a plethora of wearable applications. However, forming scalable, reliable multilayered electronic devices with heterogeneous material interfaces on soft substrates, especially on porous and anisotropic structures, is highly challenging. In this study, we demonstrate an all-inkjet-printed textile capacitor using a multilayered structure of bilayer polymer dielectrics and particle-free metal-organic decomposition (MOD) silver electrodes. Understanding the inherent porous/anisotropic microstructure of textiles and their surface energy relationship was an important process step for successful planarization. The MOD silver ink formed a foundational conductive layer through the uniform encapsulation of individual fibers without blocking fiber interstices. Urethane-acrylate and poly(4-vinylphenol)-based bilayers were able to form a planarized dielectric layer on polyethylene terephthalate textiles. A unique chemical interaction at the interfaces of bilayer dielectrics performed a significant role in insulating porous textile substrates resulting in high chemical and mechanical durability. In this work, we demonstrate how textiles' unique microstructures and bilayer dielectric layer designs benefit reliability and scalability in the inkjet process as well as the use in wearable electronics with electromechanical performance.

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