Journal
CASE STUDIES IN THERMAL ENGINEERING
Volume 25, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.csite.2021.100904
Keywords
GPU; Thermal dissipation performance; Nanofluid
Categories
Funding
- Excellent Center for Sustainable Engineering (ECSE) of the Srinakharinwirot University (SWU)
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The study showed that nanoparticles suspended in the base fluid significantly impact the physical properties and flow features of the nanofluid, leading to higher heat removal capacity and lower thermal resistance. Heat sink with lower flow channels demonstrated lower thermal resistance compared to those with higher flow channels. The findings can be used to develop a knowledge base for designing thermal cooling systems for GPUs and other electronic components.
The graphic processing unit is the active component that is an important heat source in electronic devices. The GPU cooling system's thermal dissipation performance with de-ionized water and nanofluid as coolants are presented. In the experiment, the GPU cooling system was embedded with the personal computer's GPU board, which in the overclock operating condition. The Ag nanofluid with 0.015% by volume concentration and de-ionized water is used as coolants flowing in the cooling system, considering the effects of coolant types and heat sink configurations on the thermal resistance. It found that the nanoparticles suspending in the base fluid significantly impact the nanofluid's physical properties and flow features, which results in higher removal capacity and, consequently, lower thermal resistance. The heat sink with a lower flow channel gives lower thermal resistance than those from higher ones. The results from this work have been used to develop a knowledge base that can be used to a design-related thermal cooling system for GPU or other components of electronic devices.
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