Influence of void content and morphology on the creep behavior on glass/ epoxy composites

This study aimed to evaluate the dynamic mechanical properties and the creep behavior of glass/epoxy composites containing different void contents. A 3D reconstruction using X-ray microtomography (MCT) was done to determine void content, position, and morphology. Moreover, dynamic mechanical analysis over a wide temperature range and creep tests using different temperatures (from 30 degrees C to 210 degrees C) and stress levels (1, 5, and 10 MPa) were conducted. It was found that the void content interfered with the stress transferring, noted by a decrease in the storage modulus in the glassy region and by a higher creep deformation. Moreover, as the composites pass through the glass transition region, a more abrupt decay is observed due to higher dissipation energy in a shorter time. The trend of creep behavior by temperature and stress level is equally affected by the void content and morphology.

Automated summary

This study evaluated the dynamic mechanical properties and creep behavior of glass/epoxy composites with different void contents by using X-ray microtomography. The void content was found to interfere with stress transferring, leading to lower storage modulus and higher creep deformation, especially in the glass transition region. Temperature and stress levels also played a role in affecting the creep behavior of the composites, along with void content and morphology.