4.8 Article

Digital light processing in a hybrid atomic force microscope: In Situ, nanoscale characterization of the printing process

Journal

ADDITIVE MANUFACTURING
Volume 38, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.addma.2020.101744

Keywords

Digital light processing; Stereolithography; Atomic force microscopy; In Situ characterization; Photopolymerization

Funding

  1. National Research Council Research Associateship Award at the National Institute of Standards and Technology

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The article introduces a hybrid instrument combining DLP 3D printing and atomic force microscopy for characterizing the heterogeneity of single voxels. Researchers can utilize three modalities to gain insight into the development and characteristics of voxels during and after the printing process.
Stereolithography (SLA) and digital light processing (DLP) are powerful additive manufacturing techniques that address a wide range of applications including regenerative medicine, prototyping, and manufacturing. Unfortunately, these printing processes introduce micrometer-scale anisotropic inhomogeneities due to the resin absorptivity, diffusivity, reaction kinetics, and swelling during the requisite photoexposure. Previously, it has not been possible to characterize high-resolution mechanical heterogeneity as it develops during the printing process. By combining DLP 3D printing with atomic force microscopy in a hybrid instrument, heterogeneity of a single, in situ printed voxel is characterized. Here, we describe the instrument and demonstrate three modalities for characterizing voxels during and after printing. Sensing Modality I maps the mechanical properties of justprinted, resin-immersed voxels, providing the framework to study the relationships between voxel sizes, print exposure parameters, and voxel-voxel interactions. Modality II captures the nanometric, in situ working curve and is the first demonstration of in situ cure depth measurement. Modality III dynamically senses local rheological changes in the resin by monitoring the viscoelastic damping coefficient of the resin during patterning. Overall, this instrument equips researchers with a tool to develop rich insight into resin development, process optimization, and fundamental printing limits.

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