4.6 Article

Effect of Gas Annealing on the Electrical Properties of Ni/AlN/SiC

Journal

MICROMACHINES
Volume 12, Issue 3, Pages -

Publisher

MDPI
DOI: 10.3390/mi12030283

Keywords

aluminum nitride; silicon carbide; Schottky barrier diodes; radio frequency sputtering; X-ray diffraction; X-ray photoelectron spectroscopy

Funding

  1. Technology Innovation Program [20003540]
  2. GRDC Program through the National Research Foundation (NRF) - MSIT of Korea [NRF-2018K1A4A3079552]
  3. Kwangwoon University

Ask authors/readers for more resources

Annealing Ni/AlN/SiC heterojunction devices in an atmosphere of nitrogen and oxygen significantly improves the electrical properties of the structures, increasing the on/off ratio and decreasing the ideality factor. X-ray photoelectron spectroscopy provides direct indication of the bonding structure of the AlN layer.
It is shown in this work that annealing of Schottky barrier diodes (SBDs) in the form of Ni/AlN/SiC heterojunction devices in an atmosphere of nitrogen and oxygen leads to a significant improvement in the electrical properties of the structures. Compared to the non-annealed device, the on/off ratio of the annealed SBD devices increased by approximately 100 times. The ideality factor, derived from the current-voltage (IV) characterization, decreased by a factor of similar to 5.1 after annealing, whereas the barrier height increased from similar to 0.52 to 0.71 eV. The bonding structure of the AlN layer was characterized by X-ray photoelectron spectroscopy. Examination of the N 1 s and O 1 s peaks provided direct indication of the most prevalent chemical bonding states of the elements.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.6
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available