Related references
Note: Only part of the references are listed.The decolorization of methyl orange by persulfate activated with natural vanadium-titanium magnetite
Wei Zhang et al.
APPLIED SURFACE SCIENCE (2020)
Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI
Jiakai Zhou et al.
APPLIED SURFACE SCIENCE (2020)
Synergist effect of potassium periodate and potassium persulfate on improving removal rate of Ruthenium during chemical mechanical polishing
Chao Wang et al.
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS (2020)
Modulating mesoporous Co3O4 hollow nanospheres with oxygen vacancies for highly efficient peroxymonosulfate activation
Jian Hu et al.
CHEMICAL ENGINEERING JOURNAL (2020)
Refractory petrochemical wastewater treatment by K2S2O8 assisted photocatalysis
Qianfeng He et al.
SAUDI JOURNAL OF BIOLOGICAL SCIENCES (2019)
Effect of pH Value and Glycine in Alkaline CMP Slurry on the Corrosion of Aluminum by Electrochemical Analysis
Zhi Wang et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2019)
Effect of Cystine in Alkaline CMP Slurry on Controlling the Galvanic Corrosion at Al-Co Interface
Zhi Wang et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2019)
Role of Ammonium Ions in Colloidal Silica Slurries for Ru CMP
Ziyan Wang et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2019)
Controlling of Ru/Cu Removal Rate Selectivity during CMP by Using Ammonium Sulfate and Inhibitor
Ziyan Wang et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2019)
Ammonium Persulfate and Potassium Oleate Containing Silica Dispersions for Chemical Mechanical Polishing for Cobalt Interconnect Applications
C. K. Ranaweera et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2018)
Controlling the Removal Rate Selectivity of Ruthenium to Copper during CMP by Using Guanidine Carbonate and 1, 2, 4-Triazole
Qingwei Wang et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2018)
Effect of Guanidinium Ions on Ruthenium CMP in H2O2-Based Slurry
Yichen Du et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2017)
Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium
Jie Cheng et al.
MICROELECTRONIC ENGINEERING (2016)
Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
K. V. Sagi et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2016)
Surface characteristics of ruthenium in periodate-based slurry during chemical mechanical polishing
Jie Cheng et al.
APPLIED SURFACE SCIENCE (2015)
Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry
Jie Cheng et al.
APPLIED SURFACE SCIENCE (2015)
Fabrication of ruthenium thin film and characterization of its chemical mechanical polishing process
Yi-Sin Chou et al.
MATERIALS CHEMISTRY AND PHYSICS (2015)
Effect of ionic strength on ruthenium CMP in H2O2-based slurries
Liang Jiang et al.
APPLIED SURFACE SCIENCE (2014)
Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry
Jie Cheng et al.
APPLIED SURFACE SCIENCE (2014)
Environmentally clean slurry using nano-TiO2-abrasive mixed with oxidizer H2O2 for ruthenium-film chemical mechanical planarization
Hao Cui et al.
APPLIED SURFACE SCIENCE (2013)
Effect of Oxidizers on Chemical Mechanical Planarization of Ruthenium with Colloidal Silica Based Slurry
Hao Cui et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2013)
Study of Ruthenium Oxides Species on Ruthenium Chemical Mechanical Planarization Using Periodate-Based Slurry
Hao Cui et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2012)
Ruthenium Polishing Using Potassium Periodate as the Oxidizer and Silica Abrasives
B. C. Peethala et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2011)
Reliability of copper low-k interconnects
Zsolt Tokei et al.
MICROELECTRONIC ENGINEERING (2010)
Share Paper
