Journal
MATERIALS
Volume 14, Issue 4, Pages -Publisher
MDPI
DOI: 10.3390/ma14041026
Keywords
adhesives; resin– dentin bonding; micro-tensile bond strength; non-thermal atmospheric plasma
Categories
Funding
- Deanship of Scientific Research, King Saud University
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The systematic review of 13 studies found that NTAP application can significantly improve resin-dentin bond strength in the ER mode, without the need for additional rewetting step. Further studies are needed to evaluate the effect of NTAP application on SE adhesives or UAs applied in the SE mode due to limited information available in the literature.
Objective: The objective of this review was to evaluate the effect of non-thermal atmospheric plasma (NTAP) on adhesives resin-dentin micro-tensile bond strength (mu TBS) in previously published studies. Methods: Electronic search was conducted using the Medline, Cochrane library, and Scopus databases. The included studies were laboratory studies that investigated the effect of NTAP on adhesives mu TBS to coronal dentin. Studies that evaluated the effect of NTAP on bond strength to indirect substrates, enamel or root dentin, were excluded. The methodological quality of included studies was assessed. Results: Thirteen studies were included in this systematic review. All the included studies were considered to have a medium risk of bias. NTAP significantly improved mu TBS at 24 h or after short-term aging in five studies (38.5%) and both immediate and after long-term aging in 5 studies (38.5%). In two studies (15.4%), NTAP resulted in a short-term material-dependent effect that was not stable after long-term aging. Interestingly, in one study (7.7%), NTAP had a positive effect only in the etch-and-rinse (ER) mode after long-term aging. Conclusion: Within the limitations of this systematic review, NTAP application could enhance resin-dentin mu TBS of ER adhesives or universal adhesives (UAs) applied in the ER mode. In the ER mode, the rewetting step after NTAP seems to be unnecessary. Because of the limited information currently available in the literature, further studies are required to evaluate the effect of the NTAP application on self-etch (SE) adhesives or UAs applied in the SE mode.
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