High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits

In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demonstrations were carried out of edge-coupled indium-phosphide based photonic integrated circuits (PICs). Thirty-two optical parallel connections are simultaneously, passively aligned between the probe and the PIC by means of integrated guiding channels. The initial placement tolerance is more than 4 to give a passive alignment with an optical power variation of less than 1dB. Multi-port loop-back optical power measurements are reported and the wavelength-dependent net modal gain of integrated semiconductor optical amplifiers was measured to further validate the concept.

Automated summary

This study presents high density multi-channel optical multiprobes for on-wafer parallel testing of photonic integrated circuits. The probes, fabricated in an oxynitride platform, demonstrated simultaneous passive alignment of 32 optical connections with low optical power variation. The concept was further validated through wavelength-dependent net modal gain measurements of integrated semiconductor optical amplifiers.