Journal
VACUUM
Volume 184, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.vacuum.2020.109945
Keywords
Leak element; Femtosecond laser micromachining; Molecular flow conductance; Microfluidic
Ask authors/readers for more resources
The study introduces a new type of leak element manufactured using femtosecond laser micromachining technology, which can solve the problems of serious outgassing at the sealing interface and low baking temperature. This device, which is reusable and performs as effectively as gasket-type leak elements, can be widely applied to various vacuum technologies and applications.
A previous article [C.K. Chan et al., Vacuum 180, 109650 (2020)] described a gasket-type standard leak element (SLE) that could be employed to solve the problem of serious outgassing and the constraint of a low baking temperature (<120 degrees C) caused by the use of an epoxy resin sealant (Torr Seal (R)) on a sealing interface. Here, we propose a leak element of a new type using femtosecond laser micromachining to drill a microscale channel on a double-sided ConFlat (CF) flange. Not only is the flange-type SLE reusable but also its performance is as effective as that of a gasket-type SLE. This useful device can be widely applied to many vacuum technologies and applications, which are also described in this paper.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available