Tailored wetting of copper using precise nanosecond direct laser interference patterning

Nowadays, functionalized surfaces become more and more important for industrial applications concerning wettability, ice-repellency, self-cleaning, or tribology. In this contribution, an innovative approach is presented using the direct laser interference patterning (DLIP) technique for tailoring the wettability of copper surfaces. The interference of the laser beams was conducted by using prisms for forming a like-like pattern with a spatial period A of 3.3 mu m. Moreover, texture depths up to 1.01 mu m were reached. The wettability could be set to static water contact angles between 120 degrees and 150 degrees This paper gives inside into the viability of structuring copper materials using a low-cost nanosecond laser source in combination with an innovative beam shaping setup.

Automated summary

This study presents an innovative method for tailoring the wettability of copper surfaces using DLIP technology, forming a pattern with a spatial period of 3.3 μm and texture depths up to 1.01 μm through laser interference. The wettability can be adjusted to static water contact angles between 120 and 150 degrees by utilizing a low-cost nanosecond laser source and innovative beam shaping setup.