Related references
Note: Only part of the references are listed.Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
Siliang He et al.
JOURNAL OF MATERIALS SCIENCE (2020)
Microstructures and properties of Sn-0.3Ag-0.7Cu solder doped with graphene nanosheets
Limeng Yin et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15μm Sn-Cu sandwich structure
Peng Yao et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test
Raed Al Athamneh et al.
MICROELECTRONICS RELIABILITY (2020)
Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix
Manoj Kumar Pal et al.
POWDER METALLURGY AND METAL CERAMICS (2020)
Electromigration Behavior of Low-Silver Sn-0.3Ag-0.7Cu-1.6Bi-0.2In Solder Joints
Mengyuan Li et al.
JOURNAL OF ELECTRONIC MATERIALS (2020)
Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders
G. Chen et al.
MICROELECTRONICS RELIABILITY (2020)
Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure
Wenjie Wang et al.
MICROELECTRONICS RELIABILITY (2020)
Circularity in Waste Electrical and Electronic Equipment (WEEE) Directive. Comparison of a Manufacturer's Danish and Norwegian Operations
Terje Andersen et al.
SUSTAINABILITY (2020)
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere
Mingna Wang et al.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY (2020)
A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
Anil Kunwar et al.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY (2020)
Recent advances in method of suppressing dendrite formation of tin-based solder alloys
Bokai Liao et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes
F. Khodabakhshi et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2020)
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
Sanjay Tikale et al.
MICROELECTRONICS RELIABILITY (2020)
ZrO2 Nanoparticle Embedded Low Silver Lead Free Solder Alloy for Modern Electronic Devices
Ashutosh Sharma et al.
ELECTRONIC MATERIALS LETTERS (2019)
Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
Ming-yue Xiong et al.
JOURNAL OF MATERIALS SCIENCE (2019)
On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates
Guang Ren et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Atomistic analysis of the thermomechanical properties of Sn-Ag-Cu solder materials at the nanoscale with the MEAM potential
M. Motalab et al.
JOURNAL OF MOLECULAR MODELING (2019)
Influence of thermal shock cycles on Sn-37Pb solder bumps
Guisheng Gan et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2019)
Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder
Huigai Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
The reliability of lead-free solder joint subjected to special environment: a review
Jianhao Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Recent advances in nano-materials for packaging of electronic devices
Shuye Zhang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Elastic Behavior of Coarse-Grained SnAgCu (SAC) Solder Joints Based on an Anisotropic Multi-scale Predictive Modeling Approach
Qian Jiang et al.
JOURNAL OF ELECTRONIC MATERIALS (2019)
Thermal stability of intermetallic compounds at Sn-0.7Cu-10Bi-xNi/Co interface during reflows
He Gao et al.
MATERIALS LETTERS (2019)
Recent progress on the development of Sn-Bi based low-temperature Pb-free solders
Fengjiang Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach
Xiangdong Liu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy
Ashutosh Sharma et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2016)
Effects of graphene nanosheets on interfacial reaction of Sn-Ag-Cu solder joints
Lianyong Xu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
Interfacial reaction and growth behavior of IMCs layer between Sn-58Bi solders and a Cu substrate
Xiaowu Hu et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2013)
Effects of Ti addition to Sn-Ag and Sn-Cu solders
W. M. Chen et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Strengthening mechanism of SiC-particulate reinforced Sn-3.7Ag-0.9Zn lead-free solder
X. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump
GY Jang et al.
JOURNAL OF ELECTRONIC MATERIALS (2004)
Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn-3.5Ag eutectic solder and copper substrate
JW Yoon et al.
METALS AND MATERIALS INTERNATIONAL (2003)
Share Paper
