4.7 Article

Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu-xSiC solder joints

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2021.140995

Keywords

SAC0307-xSiC; Wettability; Intermetallic compound; Mechanical property

Funding

  1. National Natural Science Foundation of China [51674056]
  2. Chongqing Talents Program [CQYC201903023]
  3. Natural Science Foundation of Chongqing [cstc2019jcyj-msxmX0175, cstc2020jcyj-msxmX0552, cstc2020jcyjmsxmX0564]
  4. University Outstanding Achievement Transformation Project of Chongqing [KJZH17137]
  5. Opening Project of Guangdong Provincial Key Laboratory of Modern Welding Technology [2018002]

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The addition of SiC can improve the wettability and tensile strength of low silver Sn-0.3Ag-0.7Cu composite solders, as well as decrease the thickness of IMC. However, when the SiC content exceeds a certain amount, the IMC grains begin to agglomerate and brittle phases appear, leading to a decrease in tensile strength.
The impacts of SiC on the wettability, mechanical properties and growth of intermetallic compound (IMC) of the low silver Sn-0.3Ag-0.7Cu (SAC0307) -xSiC composite solders paste prepared by mechanical mixing were investigated. It is found that there is an improvement in the wettability and a large reduction in the thickness of IMC with increasing SiC content, such as the contact angle shrinks by 11.48% and the thickness of IMC at the interface decreases by 63% with 0.10 wt% SiC addition. Meanwhile, according to the fracture morphology analysis, the IMC grains are refined repeatedly with increasing SiC content before less than 0.06 wt%, then agglomerated SiC and brittle phase Ag3Sn appear with further increase in SiC content. As a result, the tensile strength of solders joint increased continuously up to the maximum value of 30.49 MPa with 0.06 wt% SiC addition.

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