4.6 Article

Interfacial metal/ceramic bonding mechanism for metallization of ceramics via cold spraying

Journal

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2020.116845

Keywords

Amorphous; Bonding mechanism; Ceramic; Cold spraying; Metallization; Rupture

Funding

  1. National Natural Science Foundation of China [21705158]
  2. Key Research and Development Program of Zhejiang Province [2015C01036]
  3. International Scientific and Technological Cooperation Project of Ningbo [2017D10011]

Ask authors/readers for more resources

This study investigates the bonding mechanisms between metallic particles and ceramic substrates using aluminum particles and alumina substrates in cold spraying process. The results show that the aluminum coatings successfully bonded on the ceramic surfaces due to mechanical interlocking and heteroepitaxy, providing more details about the bonding processes.
Metallization of ceramics is drawing more and more attention in industries. The mechanisms involving high bonding strength between cold sprayed metallic coatings and ceramic substrates are not yet clear. In this study, aluminum (Al) particles and alumina (Al2O3) substrates were employed to reveal impact phenomena in cold spraying. Electron backscatter diffraction equipment (EBSD) and high-resolution transmission electron microscope (HRTEM) were used to investigate the interfacial microstructures of the Al particles and Al2O3 substrates. Computational fluid dynamics (CFD) and finite element analysis (FEA) were employed to quantitatively characterize the temperatures and plastic strains at the interfaces. The bonding strength of the Al coatings and Al2O3 substrates was measured and the analysis to the fracture morphologies was also conducted. The results show that the Al particles at the interfaces presented fine-grain and amorphous structures, and the Al2O3 substrates experienced a brittle rupture. The Al coatings bonded on the ceramic surfaces due to mechanical interlocking and heteroepitaxy. The results offer more details to understand the bonding mechanisms of metallic particles and ceramic substrates.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.6
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available