Heat transfer and flow characteristics of novel patterns of chevron minichannel heat sink: An insight into thermal management of microelectronic devices

In this study, novel patterns of chevron minichannel are introduced to mitigate the thermal resistance in microelectronic devices that receive uniform heat flux. The models are classified into four categories, which are Case A (without curvature), Case B (curvature on one side), Case C (curvature on two sides), and Case D (curvature on three sides). The analysis is carried out numerically, and its validation is checked with an experimental study. The comparison confirms the reliability of the obtained results as the deviations are less than 10%. The results show that the use of curvatures can improve the thermal performance of chevron minichannels, so the fundamental mechanisms are discussed. It is found that recirculation zones and jet-like impingement flows are the main flow features in the enhanced models. Also, thermal performance improves as the number of curvatures is increased. Higher heat absorptions are achieved by introducing curvatures on the sides of the chevron minichannel, with augmentations in the range of 1.57-3.27 times with respect to the number and position of curvatures. The model with curvature on three sides (Case D) shows the best performance as it presents the lowest values of the thermal resistance at the same pumping powers.

Automated summary

Novel patterns of chevron minichannels are introduced in this study to improve thermal performance in microelectronic devices. Through numerical analysis and experimental validation, it is found that curvatures play a crucial role in enhancing heat transfer efficiency. Among the different cases studied, the model with curvature on three sides shows the best thermal resistance performance.