Related references
Note: Only part of the references are listed.Engineering aromatic heterocycle strategy: Improving copper electrodeposition performance via tuning the bandgap of diketopyrrolopyrrole-based leveler
Kang Wang et al.
TETRAHEDRON (2020)
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating
Zhiqiang Lai et al.
ELECTROCHIMICA ACTA (2018)
The effect of tricyclazole as a novel leveler for filling electroplated copper microvias
Chaohui Liao et al.
JOURNAL OF ELECTROANALYTICAL CHEMISTRY (2018)
Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler
Myung Hyun Lee et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2017)
Microvia Filling by Copper Electroplating Using a Modified Safranine T as a Leveler
H. P. Zhu et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2017)
Rational synthesis and comparative investigation on a series of fluorinated aryl substituted diketopyrrolopyrrole
Jie Xu et al.
TETRAHEDRON (2017)
4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper
Mingxing Tang et al.
RSC ADVANCES (2017)
Electrodeposition of Copper for Three-Dimensional Metamaterial Fabrication
Shendu Yang et al.
ACS APPLIED MATERIALS & INTERFACES (2017)
Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating
Biao Chen et al.
ACS APPLIED MATERIALS & INTERFACES (2017)
2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating
Chun Chang et al.
ELECTROCHIMICA ACTA (2016)
Diketopyrrolopyrrole: brilliant red pigment dye-based fluorescent probes and their applications
Matinder Kaur et al.
CHEMICAL SOCIETY REVIEWS (2015)
Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations
Zhanwu Lei et al.
ELECTROCHIMICA ACTA (2015)
Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation
Shaojun Ren et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2015)
Optimization of the Copper Plating Process Using the Taguchi Experimental Design Method I. Microvia Filling by Copper Plating Using Dual Levelers
Chia-Fu Hsu et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2015)
Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method
S. Ren et al.
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING (2015)
Adsorption behavior of triblock copolymer suppressors during the copper electrodeposition
Ning Xiao et al.
ELECTROCHIMICA ACTA (2014)
Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition
Yuanming Chen et al.
ELECTROCHIMICA ACTA (2014)
A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode
Xubin Lu et al.
JOURNAL OF ELECTROANALYTICAL CHEMISTRY (2014)
High-Molecular-Weight Regular Alternating Diketopyrrolopyrrole-based Terpolymers for Efficient Organic Solar Cells
Koen H. Hendriks et al.
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION (2013)
Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison
Chong Wang et al.
ELECTROCHIMICA ACTA (2013)
Influence of branched quaternary ammonium surfactant molecules as levelers for copper electroplating from acidic sulfate bath
An-yin Wang et al.
ELECTROCHIMICA ACTA (2013)
Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating
Po-Fan Chan et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2013)
Highly p-Extended Copolymers with Diketopyrrolopyrrole Moieties for High-Performance Field-Effect Transistors
Huajie Chen et al.
ADVANCED MATERIALS (2012)
Multiwfn: A multifunctional wavefunction analyzer
Tian Lu et al.
JOURNAL OF COMPUTATIONAL CHEMISTRY (2012)
Diketopyrrolopyrrole-Diketopyrrolopyrrole-Based Conjugated Copolymer for High-Mobility Organic Field-Effect Transistors
Catherine Kanimozhi et al.
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY (2012)
Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition
M. Takeuchi et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2012)
Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating Solution
Su-Mei Huang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2012)
Effect of organic dye on copper metallization of high aspect ratio through hole for interconnect application
R. Manu et al.
MATERIALS CHEMISTRY AND PHYSICS (2012)
Classification of suppressor additives based on synergistic and antagonistic ensemble effects
P. Broekmann et al.
ELECTROCHIMICA ACTA (2011)
Rapid Galvanostatic Determination on Levelers for Superfilling in Cu Electroplating
Ho-Cheng Tsai et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2010)
Microvia filling by copper electroplating using diazine black as a leveler
Wei-Ping Dow et al.
ELECTROCHIMICA ACTA (2009)
Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers
Wei-Ping Dow et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2009)
Filling mechanism in microvia metallization by copper electroplating
Wei-Ping Dow et al.
ELECTROCHIMICA ACTA (2008)
Enhancement of filling performance of a copper plating formula at low chloride concentration
Wei-Ping Dow et al.
ELECTROCHIMICA ACTA (2008)
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
T. P. Moffat et al.
ELECTROCHIMICA ACTA (2007)
A method for microvia-fill process modeling in a cu plating system with additives
A. Pohjoranta et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2007)
An electrochemical and in situ SERS study of Cu electrodeposition from acidic sulphate solutions in the presence of 3-diethylamino-7-(4-dimethylaminophenylazo)-5-phenylphenazinium chloride (Janus Green B)
B. Bozzini et al.
JOURNAL OF APPLIED ELECTROCHEMISTRY (2006)
Evaluating the filling performance of a copper plating formula using a simple galvanostat method
WP Dow et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2006)
Impact of pulse parameters on current distribution in high aspect ratio vias and through-holes
JM Lee et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2005)
Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating
WP Dow et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2005)
Roles of chloride ion in microvia filling by copper electrodeposition - II. Studies using EPR and galvanostatic measurements
WP Dow et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2005)
Share Paper
