Three-Dimensional Stretchable Microelectronics by Projection Microstereolithography (PμSL)

Stretchable and flexible electronics conformal to human skin or implanted into biological tissues has attracted considerable interest for emerging applications in health monitoring and medical treatment. Although various stretchable materials and structures have been designed and manufactured, most are limited to two-dimensional (2D) layouts for interconnects and active components. Here, by using projection microstereolithography (P mu SL)-based three-dimensional (3D) printing, we introduce a versatile microfabrication process to push the manufacturing limit and achieve previously inaccessible 3D geometries at a high resolution of 2 mu m. After coating the printed microstructures with thin Au films, the 3D conductive structures offer exceptional stretchability (similar to 130%), conformability, and stable electrical conductivity (<5% resistance change at 100% tensile strain). This fabrication process can be further applied to directly create complicated 3D interconnect networks of sophisticated active components, as demonstrated with a stretchable capacitive pressure sensor array here. The proposed scheme allows a simple, facile, and scalable manufacturing route for complex, integrated 3D flexible electronic systems.

Automated summary

This study introduces a versatile microfabrication process using PμSL-based 3D printing to achieve high-resolution 3D stretchable electronic structures with exceptional stretchability and stable electrical conductivity. The fabrication process can also create complex 3D interconnect networks, as demonstrated with a stretchable capacitive pressure sensor array.