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Bending Setups for Reliability Investigation of Flexible Electronics

Journal

MICROMACHINES
Volume 12, Issue 1, Pages -

Publisher

MDPI
DOI: 10.3390/mi12010078

Keywords

flexible electronics; mechanical characterization; bending; bending reliability; static bending; dynamic bending; bending apparatus; push to flex; roll to flex; three-point bending; four-point bending

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Flexible electronics is a rapidly growing technology with applications in various fields, with a focus on reliability during repeated bending. This paper presents commonly used methods for investigating the bending reliability of flexible electronics, including both static and dynamic bending test methods.
Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

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