Journal
MATERIALS
Volume 14, Issue 2, Pages -Publisher
MDPI
DOI: 10.3390/ma14020354
Keywords
Ge; germanium; doping; GaN; gallium; nitride; MOVPE; epitaxy
Categories
Funding
- Polish National Centre for Science [2019/03/X/ST5/01907]
- Foundation for Polish Science [TEAM TECH/20174/24]
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The research showed that Germanium is more readily incorporated at low temperature, high growth rate and high V/III ratio in Ge-doped GaN layers. V-pit formation can be blocked at high temperature or low V/III ratio, but the latter may cause step bunching.
The effect of growth temperature and precursor flow on the doping level and surface morphology of Ge-doped GaN layers was researched. The results show that germanium is more readily incorporated at low temperature, high growth rate and high V/III ratio, thus revealing a similar behavior to what was previously observed for indium. V-pit formation can be blocked at high temperature but also at low V/III ratio, the latter of which however causing step bunching.
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