Effect of aging process on the microstructure and properties of Cu-Cr-Ti alloy

The effect of aging treatment on the microstructure of Cu-Cr-Ti alloy was studied by Scanning electron microscope (SEM) and Transmission electron microscope (TEM), and its electrical conductivity, microhardness and tensile strength were also measured. The results showed that the Cu-Cr-Ti alloy had a microhardness of 166 H V, tensile strength of 551 MPa and electrical conductivity of 78.2%IACS after being solution treated at 960 degrees C, 80% cold rolled and aged at 500 degrees C for 1 h. TEM characterization revealed that the precipitates were fully coherent with copper matrix after aging at 450 degrees C for 1 h. Two precipitates of face-centered cubic (fcc) and body-centered cubic (bcc) Cr structures existed in the matrix at the same time after aging at 500 degrees C for 1 h, and the existence of ordered phases accelerated the transformation from fcc to bcc. After aging at 550 degrees C for 1 h, the relationship between precipitates and the matrix transformed into a semi-coherent relationship, and the strength gradually deteriorated.

Automated summary

The study revealed that aging treatment significantly affected the microstructure and properties of the Cu-Cr-Ti alloy, with different aging temperatures leading to distinct precipitates formation and changes in the relationship between precipitates and the matrix. The alloy exhibited high microhardness, tensile strength, and electrical conductivity under specific aging conditions.