Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 799, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2020.140161
Keywords
Mechanical alloying; Dispersion strengthening; In situ reaction; Copper alloys; Tungsten
Categories
Funding
- State Key Laboratory for Advanced Metals and Materials of China [2019-Z10]
- Fundamental Research Funds for the Central Universities [FRF-GF-19-012AZ]
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A novel dispersion-strengthened copper-tungsten alloy was prepared by mechanical alloying, showing improved mechanical properties, electrical conductivity, and thermal stability. The cold-rolled Cu-5 vol% W alloy retains high tensile strength and reasonable ductility even after annealing at 800 degrees C.
In this study, a novel dispersion-strengthened copper-tungsten alloy with improved mechanical properties, electrical conductivity, and thermal stability was prepared by mechanical alloying. Cu-WO3 powder blend was milled to obtain a uniform dispersion of WO3 in copper and the WO3 particles were subsequently reduced to tungsten to obtain the Cu-W composite. The tungsten nanoparticles dispersed in the copper matrix have an average size of 32 nm, without agglomeration, and are highly stable. The cold-rolled Cu-5 vol% W reached a tensile strength of 596 MPa, elongation of 7.7%, and electrical conductivity of 84% IACS (International annealing copper standard). In particular, the cold-rolled alloy retains the tensile strength of over 400 MPa and reasonable ductility even after annealing at 800 degrees C. The remarkable improvement in mechanical properties and thermal stability are attributed to the pinning effect of highly dispersed nano-sized W particles in the Cu matrix.
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