A comparative analysis over different properties of TiN, TiAlN and TiAlSiN thin film coatings grown in nitrogen gas atmosphere

Titanium nitride (TiN), Titanium aluminum nitride (TiAlN), and Titanium aluminum silicon nitride (TiAlSiN) coatings were deposited over Silicon (Si) (100) substrates using chemical vapor deposition (CVD) process at a constant temperature under different N-2 flow rate. Scanning electron microscopy (SEM) images reveal a smoother TiN coating surface compared to other coatings. Atomic force microscopy (AFM) indicates enhancement of particle size of TiN and TiAlN coatings with higher N-2 gas flow rate. However, the particle size of TiAlSiN found to decrease with a higher N-2 flow rate. X-ray diffraction (XRD) results confirm the diffraction phases of TiN, TiAlN and TiAlSiN at (111) and (200) crystal planes. The electrochemical test indicates higher corrosion resistance of TiAlSiN coating as compared to other coatings. Nano-indentation results reveal that TiAlSiN possesses higher hardness (H) and Young's modulus (E) as compared to other coatings.

Automated summary

Titanium nitride (TiN), Titanium aluminum nitride (TiAlN), and Titanium aluminum silicon nitride (TiAlSiN) coatings deposited over Silicon (Si) (100) substrates using chemical vapor deposition (CVD) process exhibit different characteristics, including surface smoothness, particle size, corrosion resistance, and hardness.