Journal
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
Volume 144, Issue 6, Pages 2483-2495Publisher
SPRINGER
DOI: 10.1007/s10973-020-10453-z
Keywords
Nanofluid; Thermal conductivity; Molecular dynamics simulation; Aluminum substrate
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The addition of CuO nanoparticles into water increases the thermal conductivity of nanofluid, with larger nanoparticle size leading to higher thermal conductivity and faster phase transition.
The thermal behavior of CuO-water nanofluid is examined on an aluminum surface. The dimensions of simulation boxes are 70 x 70 x 30 angstrom(3), 60 x 60 x 30 angstrom(3), and 50 x 50 x 30 angstrom(3), with the corresponding number of atoms of 104,351, 123,958, and 145,980. Thermal conductivities of fluid and nanofluid are calculated using the Green-Kubo formula. Molecular dynamics simulation results confirm the direct effect of nanoparticles on the values of thermal conductivities of fluid and nanofluid. The value of 0.59 Wm(-1) K-1 is obtained for the thermal conductivity of water. But adding three CuO nanoparticles into the water increases this value to 0.85 Wm(-1) K-1. The same effect is observed on the thermal behavior of nanofluid upon increasing the size of CuO nanoparticles that raises the value of the thermal conductivity of nanofluid to 0.99 Wm(-1) K-1. The heat flux is increased by adding the nanoparticles into the base fluid; thereby, the phase transition (evaporation) occurs in fewer time steps.
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