Phosphorus doping of ZnO using spin-on dopant process: A better choice than costly and destructive ion-implantation technique

Radio frequency sputtered ZnO thin films doped with phosphorus (ZnO:P) have been prepared employing spinon dopant process. In the SOD process, the dopant film has been spin-coated on a silicon substrate and positioned close to the as-deposited undoped ZnO film at high temperature to perform the phosphorus doping. The highresolution X-ray diffraction measurement reveals that the prepared ZnO:P films are good in crystalline quality which improves further by annealing. It is found that the full-width half-maximum corresponding to (002) peak of SOD processed thin films is much narrower than previously reported ion-implanted thin films, indicating the better crystalline quality of SOD processed phosphorus-doped ZnO thin films. The X-ray photoelectron spectroscopy measurement signifies that the P2O5 decomposes into two phosphorus atoms behaving like an acceptor dopant and five oxygen atoms which may fill in oxygen vacancies at high-temperature annealing. The photoluminescence spectra discover the acceptor bound exciton peak at 3.35 eV and free electron to acceptor level transitions at 3.31 eV. The calculated acceptor binding energy is 127 meV for the phosphorus dopant which works as a shallow acceptor level. It is found that the phosphorus-doped ZnO thin films prepared using the SOD process have much superior structural and optical properties in comparison to previously reported ion-implanted film. This study demonstrates that the SOD process is much superior than the ion-implantation process to produce high-quality ZnO:P thin films for very stable p-type conduction.

Automated summary

Phosphorus-doped zinc oxide thin films prepared using the SOD process exhibit good crystalline quality that improves further after annealing. Measurements of X-ray diffraction and X-ray photoelectron spectroscopy show superior properties, including narrow full-width half-maximum and shallow acceptor levels.