Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 50, Issue 3, Pages 1083-1089Publisher
SPRINGER
DOI: 10.1007/s11664-020-08619-4
Keywords
Tin whisker; Ti2SnC; ceramic; nucleation; morphology; mechanism
Categories
Funding
- China Postdoctoral Science Foundation [2019M661687]
- National Natural Science Foundation of China (NSFC) [52001158, 51902051, 51731004]
- International Postdoctoral Exchange Program of Southeast University
- Fundamental Research Funds for the Central Universities
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The research found that tin whisker growth propensity increases at higher temperatures or in an oxidizing atmosphere, and whisker nucleation can be accelerated at elevated temperatures. Furthermore, whiskers formed in argon gradually evolve into a faceted morphology driven by the reduction of surface energy. These findings provide valuable insights into tin whisker growth.
Tin whisker growth behavior has resisted interpretation for approximately 70 years due to many intricate influencing factors and its unpredictability. In this work, tin whisker growth behavior on Ti2SnC under different cultivation conditions was investigated to understand the underlying mechanisms. It was found that higher tin whisker growth propensity is reached at higher cultivation temperature or in an oxidizing cultivation atmosphere, and whisker nucleation can be accelerated at elevated temperature. Furthermore, the whiskers formed in argon gradually evolve into a faceted morphology, which is driven by the reduction of surface energy. The findings herein provide valuable clues of tin whisker growth.
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