Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 50, Issue 3, Pages 893-902Publisher
SPRINGER
DOI: 10.1007/s11664-020-08602-z
Keywords
Indium; lead-free solder; electromigration; TEM; intermetallics; thermal aging
Categories
Funding
- Intel Corporation
Ask authors/readers for more resources
The addition of Indium has shown promise as an alloying element in Sn-rich solders, impacting melting temperature and microstructure. While its effect on microstructure under certain conditions is still not fully understood, Indium has been observed to slow intermetallic growth in electromigration testing and form nanoparticles in the solder matrix.
Recently In has been considered as an additional alloying element in Sn-rich solders primarily due to its abilities to decrease the solder melting temperature and to modify mechanical properties and microstructure. While In is an attractive candidate for addition to solder, its effect on solder microstructure is not well understood. In order to study the effect of minor In additions on Sn-rich solder alloys, solder joints were prepared using Sn-0.7 wt.% Cu and Sn-0.7 wt.% Cu- < 1 wt.% In alloys. Thermal aging and electromigration testing were done, followed by post-mortem microstructure characterization including composition, morphology, and grain structure. The addition of In did not appear to affect the microstructure under thermal aging conditions, but slowed interfacial intermetallic growth under electromigration, particularly of the compound Cu6Sn5. Transmission electron microscope analysis revealed the formation of Cu7In3 IMC nanoparticles, which were semicoherent with the surrounding Sn matrix.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available