Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 844, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2020.156088
Keywords
Coefficient of thermal expansion; Laser shock peening; TiC; 7075 aluminum alloy; Friction stir welding; Composites
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Funding
- National Natural Science Foundation of China [51701088, 51575242]
- Natural Science Major Foundation of the Jiangsu Higher Education Institutions [19KJA460003]
- Natural Science Foundation of Jiangsu Province [BK20170313]
- Applied Science Foundation of Jiangsu University of Technology [KYY18043]
- Open Foundation of Jiangsu Key Laboratory of 3D Printing Equipment and Application Technology [2018KFKT01]
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Integration of laser shock peening (LSP) and friction stir welding (FSW) was conducted for TiC strengthening on 7075 aluminum (Al) alloys. During FSW, TiC nanoparticles were mixed by using a stir pin to obtain TiC coating with FSWed joints. Nanocrystallines on the surface of Al-based hybrid composites with high-density dislocation were generated through LSP. Microstructural variables, including dislocations and precipitates of the different treatment specimens, were characterized through transmission electron microscopy and X-ray diffractometry. Thermal expansion of cylindrical treated samples was measured from room temperature to 300 degrees C. The coefficient of thermal expansion (CTE) value of the LSPed samples with TiC decreased by approximately 30% compared with that of the as-FSW sample. Differential scanning calorimetry (DSC) provides insights into the thermal expansion and strengthening mechanisms of LSP. These conditions were mainly caused by the acceleration of precipitated phase transformation from metastable eta' to stable h, resulting in the negative growth of the lattice constant of Al matrix and a decrease in CTE. In addition, the low CTE and dislocation pinning are important in providing a significant synergistic contribution to retard the thermal expansion of Al (7075)-based hybrid composites. (c) 2020 Elsevier B.V. All rights reserved.
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