4.7 Article

Multifunctional sponges with flexible motion sensing and outstanding thermal insulation for superior electromagnetic interference shielding

Journal

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2020.106143

Keywords

Electromagnetic interference shielding; Multifunctional sponges; Motion sensing; Thermal insulation

Funding

  1. Foundation of National Natural Science Foundation of China [51973173]
  2. Natural Science Basic Research Plan for Distinguished Young Scholars in Shaanxi Province of China [2019JC11]
  3. Natural Science Foundation of Shaanxi Province [2020JQ-164]
  4. China Aerospace Science and Industry Corporation [2019-HT-XG]
  5. Foundation of Aeronautics Science Fund [2017ZF53071]
  6. Henan University of Science and Technology [2020-RSC01]
  7. School-enterprise Collaborative Innovation Fund for Graduate Students of Northwestern Polytechnical University [XQ201913]
  8. Undergraduate InnovationAMP
  9. Business Program in Northwestern Polytechnical University [S202010699483]
  10. Polymer Electromagnetic Functional Materials Innovation Team of Shaanxi Sanqin Scholars

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Although electrically conductive polymer composites (ECPCs) are promising in the application of electromagnetic interference (EMI) shielding, how to endow the ECPCs multifunctionality is still a huge challenge. In this work, the novel polyurethane@polydopamine@silver nanoparticles (PU@PDA@Ag) sponges with excellent compressibility, flexible motion sensing, outstanding thermal insulation and superior EMI shielding properties were successfully fabricated by a facile bio-response method, which could be obtained by following two steps: (i) PDA was decorated on the surface of PU sponges by dopamine self-polymerization. (ii) Ag nanoparticles were insitu grown on the surface of PU sponges by electroless plating. PU@PDA@Ag sponge had the maximum EMI shielding effectiveness (SE) of 84 dB, and the corresponding specific SE and absolute SE were 2625 dB cm(3) g(-1) and 5250 dB cm(2) g(-1), much higher than those of other shielding foams/sponges. Meanwhile, PU@PDA@Ag sponge possessed low thermal conductivity (52.72 mW/mK), excellent compression resilience and piezoresistive properties.

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