4.8 Article

Choosing the Right Lignin to Fully Replace Bisphenol A in Epoxy Resin Formulation

Journal

CHEMSUSCHEM
Volume 14, Issue 4, Pages 1184-1195

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/cssc.202002729

Keywords

bisphenol A; biomass; epoxidation; lignin; polymers

Funding

  1. Advanced Biochemical Thailand Co., Ltd
  2. USDA National Institute of Food and Agriculture, McIntire Stennis

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Thirteen unmodified lignin samples from various biomass sources were used to replace bisphenol A (BPA) in epoxy resin formulations using a novel method. It was found that lignins with higher phenolic hydroxy content and lower molecular weights were more suitable for this purpose, and a regression model was developed to establish correlations between lignin properties and epoxy contents. Additionally, epoxidized lignin samples with high epoxy contents showed comparable performance to a petroleum-based epoxy system when cured with a bio-based hardener.
Thirteen unmodified lignin samples from different biomass sources and isolation processes were characterized and used to entirely replace bisphenol A (BPA) in the formulation of solubilized epoxy resins using a developed novel method. The objective was to measure the reactivity of different lignins toward bio-based epichlorohydrin (ECH). The epoxy contents of various bio-based epoxidized lignins were measured by titration and H-1 NMR spectroscopy methods. A partial least square regression (PLS-R) model with 92 % fitting accuracy and 90 % prediction ability was developed to find correlations between lignin properties and their epoxy contents. The results showed that lignins with higher phenolic hydroxy content and lower molecular weights were more suitable for replacing 100 % of toxic BPA in the formulation of epoxy resins. Additionally, two epoxidized lignin samples (highest epoxy contents) cured by using a bio-based hardener (Cardolite GX-3090) were found to show comparable thermomechanical performances and thermal stabilities to a petroleum-based (DGEBA) epoxy system.

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