Self-reducible copper complex inks with two amines for copper conductive films via calcination below 100 °C

Herein is described a new method for the fabrication of copper conductive films at temperatures of less than 100 degrees C. This method uses self-reducible copper complex inks and two types of amines. Copper complex inks with only 3-butylpyridine are capable of self-reducing at temperatures below 100 degrees C, but the process is accompanied by the formation of cracks that results in metallic copper films that are highly resistive. The combination of 3-butylpyridine and dipmpylamine in self-reducible copper complex inks prevents the generation of cracks via the connection of self-reduced copper particles in the film, which results in low volume resistivity.

Automated summary

A new method for fabricating copper conductive films at temperatures below 100 degrees C is described, using self-reducible copper complex inks and two types of amines. The addition of a combination of 3-butylpyridine and dipmpylamine in the self-reducible copper complex inks prevents crack formation, resulting in metallic copper films with low volume resistivity.