Journal
CARBON
Volume 176, Issue -, Pages 118-125Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.carbon.2020.12.028
Keywords
Polyimide; Carbon nanotube; Graphene; Electromagnetic interference shielding; Compressibility
Funding
- National Natural Science Foundation of China [21704070, 51673134, 51721091]
- Department of Science and Technology of Sichuan [2019YJ0043]
- Fundamental Research Funds for the Central Universities [2017SCU04A03, sklpme2017306, 2012017yjsy102]
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A lightweight polyimide foam with excellent EMI shielding performance and good compression stability was successfully designed by achieving ideal CNT dispersion through the interaction between functionalized graphene and CNT, providing a new approach for the aerospace industry.
Designing lightweight polyimide (PI) foam with low density, high heat resistance, excellent electromagnetic interference (EMI) shielding ability and good compressibility is urgent in practical application of aeronautics and aerospace. However, to guarantee high EMI shielding effectiveness (EMI SE), high conductive filler content was always required, which would lead to high stiffness and poor compressibility of the composite foam, because of the agglomerations and the limitation of the interaction force between conductive filler and PI matrix. Herein, desirable CNT dispersion could be achieved with the assistant of the functional group on graphene oxide surface and the pi-pi conjugation between graphene and CNT. The resultant composite foam exhibits an average EMI SE of 28.2 dB and specific EMI SE (SSE) of 7050 dB cm(2) g(-1) at an only 0.02 g cm(-3) density. Meanwhile, the multi-layer structure formed in cell wall and chemical bonding between PI matrix and graphene flakes endow the composite foam with good cycling compression stability. Moreover, the high decomposition temperature (T-d, 10%) of 630.9 degrees C exhibits great competition with other previously reported PI-based composites. These features confirm the potential of the CNT/graphene/PI foam as a lightweight, compressive, heat-resistant material for efficient EMI shielding and electromagnetic wave absorption. (C) 2021 Elsevier Ltd. All rights reserved.
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