Effect of Si content on the uniaxial tensile behavior of Mo-Si solid solution alloys

Recrystallized binary Mo-0.2 wt.% Si (Mo-0.68 at.% Si) and Mo-0.3 wt.% Si (Mo-1.0 at.% Si) alloys and a ternary Mo-0.75 wt.% Si-0.14 wt.% B (Mo-2.5 at.% Si-1.2 at.% B) alloy were tested in uniaxial tension as a function of temperature in vacuum and the results are compared to previous results on recrystallized commercial purity (CP) Mo and a binary Mo-0.1 wt.% Si (Mo-0.34 at.% Si) solid solution alloy. Yield strength increases with increasing Si content at all temperatures examined except at room temperature where the 0.1 wt.% Si alloy demonstrates softening; atomistic simulation confirms this behavior to be associated with Si segregation to the core and the associated ease of kink nucleation. Tensile ductility at room temperature rapidly deteriorates with increasing Si content in solid solution but in the Mo-0.3 wt.% Si solid solution alloy, tensile ductility of similar to 10% was measured at 300 degrees C and thereafter, it increases rapidly at higher temperatures. Serrated flow occurs in the temperature range 600 degrees C similar to 800 degrees C with the serration amplitude increasing with increasing Si content; atomistic simulation illustrates 0 trapping by Si in solid solution and subsequent de-trapping/release at higher temperatures that can account for the onset temperature delay of serrated flow in these Mo-Si solid solution alloys relative to commercial purity Mo. The serrated flow phenomenon is accompanied by significant work hardening; the presence of dislocation tangles, dipoles and prismatic loops in specimens fractured above >= 700 degrees C accounts for the observed work hardening. (C) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Automated summary

Increasing Si content enhances the yield strength of Mo alloys, except for the softening phenomenon observed in the 0.1 wt.% Si alloy at room temperature. Tensile ductility decreases rapidly with increasing Si content in solid solution, but the Mo-0.3 wt.% Si solid solution alloy exhibits around 10% tensile ductility at 300 degrees C.