Journal
ACS NANO
Volume 15, Issue 1, Pages 829-839Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsnano.0c07352
Keywords
copper nanosheet; single-crystalline; 2D metallic nanomaterials; hierarchal structure; porous foil; electromagnetic interference shielding
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Funding
- National Research Foundation of Korea [2020R1A2C2010163]
- Korea Institute of Science and Technology Institutional Program
- Korea Institute for Advancement of Technology - Korea Government (MOTIE) [P0002007]
- National Creative Research Laboratory program [2012026372]
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Research has shown that hierarchical porous Cu foils assembled from Cu nanosheets exhibit outstanding EMI shielding performance, suggesting that Cu nanosheets and their layer-by-layer assembly are a promising technology for practical electronic applications.
The emergence of technologies, such as 5G telecommunication, electric vehicles, and wearable electronics, has prompted demand for ultrahigh-performance and cost-effective shielding materials to protect against both the potentially harmful effects of electromagnetic interference (EMI) on human health and electronic device operation. Here, we report hierarchical porous Cu foils via an assembly of single-crystalline, nanometer-thick, and micrometer-long copper nanosheets and their use in EMI shielding. Layer-by-layer assembly of Cu nanosheets enabled the formation of a hierarchically structured porous Cu film with features such as multilayer stacking; two-dimensional networking; and a layered, sheetlike void architecture. The hierarchical-structured porous Cu foil exhibited outstanding EMI shielding performance compared to the same thickness of dense copper and other materials, exhibiting EMI shielding effectiveness (SE) values of 100 and 60.7 dB at thicknesses of 15 and 1.6 mu m, respectively. In addition, the EMI SE of the hierarchical porous Cu film was maintained up to 18 months under ambient conditions at room temperature and showed negligible changes after thermal annealing at 200 degrees C for 1 h. These findings suggest that Cu nanosheets and their layer-by-layer assembly are one of the promising EMI shielding technologies for practical electronic applications.
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