4.8 Article

Fused Filament Fabrication 4D Printing of a Highly Extensible, Self-Healing, Shape Memory Elastomer Based on Thermoplastic Polymer Blends

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 13, Issue 11, Pages 12777-12788

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsami.0c18618

Keywords

4D printing; fused filament fabrication 3D printing; shape memory polymer; self-healing; high extensibility; thermoplastic elastomer

Funding

  1. University of Akron

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Researchers successfully printed a polymer blend with high extensibility, shape memory, and self-healing capabilities using a low-cost fused filament fabrication technology. By controlling the orientation of printed fibers, they achieved high strain at break and utilized a self-healing agent, PCL, to enable the material to heal scratches and cracks.
A polymer blend with high extensibility, exhibiting both shape memory and self-healing, was 4D printed using a low-cost fused filament fabrication (FFF, or fused deposition modeling, FDM) 3D printer. The material is composed of two commercially available commodity polymers, polycaprolactone (PCL), a semi-crystalline thermoplastic, and polystyrene-block-poly(ethylene-co-butylene)-block-polystyrene (SEBS), a thermoplastic elastomer. The shape memory and self-healing properties of the blends were studied systematically through thermo-mechanical and morphological characterization, providing insight into the shape memory mechanism useful for tuning the material properties. In 3D-printed articles, the orientation of the semi-crystalline and micro-phase-separated domains leads to improvement of the shape memory property and extensibility of this material compared to compression-molded samples. By controlling the orientation of the printed fibers, we achieved a high strain at break over 1200%, outperforming previously reported flexible 4D-printed materials. The self-healing agent, PCL, enables the material to heal scratches and cracks and adhere two surfaces after annealing at 80 degrees C for 30 min. The high performance, multi-functionality, and potential scalability make it a promising candidate for a broad spectrum of applications, including flexible electronics, soft actuators, and deployable devices.

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