Journal
CRYSTALS
Volume 10, Issue 9, Pages -Publisher
MDPI
DOI: 10.3390/cryst10090842
Keywords
AlGaN; GaN; high electron mobility transistor; catalytic-CVD; SiN(x)passivation; current collapse
Funding
- BK21 plus Project in 2019, Ministry of Trade, Industry and Energy [10067636]
- Basic Science Research Programs [2015R1A6A1A03031833, 2019R1A2C1008894]
- Civil-Military Technology Cooperation Program [17-CM-MA-03]
- Agency for Defense Development (ADD), Republic of Korea [17-CM-MA-03-MKE, 17-CM-MA-03] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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We optimized a silicon nitride (SiNx) passivation process using a catalytic-chemical vapor deposition (Cat-CVD) system to suppress the current collapse phenomenon of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs). The optimized Cat-CVD SiN(x)film exhibited a high film density of 2.7 g/cm(3)with a low wet etch rate (buffered oxide etchant (BOE) 10:1) of 2 nm/min and a breakdown field of 8.2 MV/cm. The AlGaN/GaN-on-Si HEMT fabricated by the optimized Cat-CVD SiN(x)passivation process, which had a gate length of 1.5 mu m and a source-to-drain distance of 6 mu m, exhibited the maximum drain current density of 670 mA/mm and the maximum transconductance of 162 mS/mm with negligible hysteresis. We found that the optimized SiN(x)film had positive charges, which were responsible for suppressing the current collapse phenomenon.
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