4.8 Article

Multipronged heat-exchanger based on femtosecond laser-nano/microstructured Aluminum for thermoelectric heat scavengers

Journal

NANO ENERGY
Volume 75, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.nanoen.2020.104987

Keywords

Heat-sink; Thermoelectric generators; Micro/nanostructuring; Emissivity

Funding

  1. Bill AMP
  2. Melinda Gates Foundation [OPP1157723]
  3. National Science Foundation [1701163, 1722169]
  4. Div Of Industrial Innovation & Partnersh
  5. Directorate For Engineering [1701163] Funding Source: National Science Foundation
  6. Div Of Industrial Innovation & Partnersh
  7. Directorate For Engineering [1722169] Funding Source: National Science Foundation

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Femtosecond (fs) laser processing can significantly alter the optical, thermal, mechanical, and electrical properties of materials. Here, we show that fs-laser processing transforms aluminum (Al) to a highly efficient and multipronged heat exchanger. By optimizing the formed surface nano- and microstructures, we increase the Al emissivity and surface area by 700% and 300%, respectively. Accordingly, we show that fs-laser treated Al (fs-Al) increases the radiative and convective cooling power of fs-Al by 2100% and 300%, respectively, at 200 degrees C. As a direct application, we use fs-Al as a heat sink for a thermoelectric generator (TEG) and demonstrate a 280% increase in the TEG output power compared to a TEG with an untreated Al heat exchanger at 200 degrees C. The multipronged enhancement in fs-Al heat exchange properties lead to an increase in the TEG output power over a wide temperature (T) range (T > 50 degrees C). Conversely, a simple radiative cooling heat exchanger increases the TEG output power within a limited temperature range (T > 150 degrees C). We investigate the laser processing parameters necessary to maximize the spectral emissivity and surface area of fs-Al. Fs-Al promises to be a widely used and compact heat exchanger for passive cooling of computers and data centers as well as to increase the efficiency of TEGs incorporated in sensors and handheld electronics.

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