Journal
ACS SUSTAINABLE CHEMISTRY & ENGINEERING
Volume 8, Issue 48, Pages 17639-17650Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acssuschemeng.0c04427
Keywords
cellulose nanofiber; polydopamine-assisted metallization; thermal interface; thermal conductivity; electric insulation
Categories
Funding
- National Natural Science Foundation of China [51963003]
- Youth Science and Technology Talent Growth Project of Guizhou Province Education Department [[2018]106]
- Science and Technology Plan Project of Guizhou Province [[2018]5781, [2019]1084]
- Key project of Fundamental research in Guizhou province [[2020]1Z044]
- Guizhou Science Fund for Excellent Young Scholars [20195665]
- Open Fund program of Southwest University of Science and Technology [18zxgk01]
- Scientific Research Project of Introduced Talents of Guizhou University [(2017)07]
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High thermal resistance frequently occurring at both filler-matrix and filler-filler interfaces lays down paramount bottlenecks for thermal management materials (TMMs). Herein, pony-size silver (Ag, 2-8 nm) nanoparticles are first constructed on nanodiamonds (NDs) with the assistance of environment-friendly polydopamine (PDA), which is rather different from larger Ag nanoparticles (AgNPs, 10-25 nm) simply deposited on NDs. Such ternary heterostructures impart low interfacial thermal resistance in cellulose nanofiber (CNF) composites and thereby allow high thermal conductivity but electric insulation. It is worth noting that the interfacial thermal resistance of CNF/Ag-PDA-ND (4.11 X 10(-7) m(2) K W-1) is exceptionally 1-2 orders of magnitude lower than those of CNF/Ag-ND (7.28 X 10(-6) m(2) K W-1) and CNF/ND (5.14 X 10(-5) m(2) K W-1) mainly due to the improved contact area between NDs assisted by PDA-Ag and even the bridging effect of AgNPs between NDs and CNFs. Of particular interest is our first establishment of an excellent heat interface (94.4% reduction in interfacial heat resistance) by introducing environment- friendly PDA during the metallization process rather than the reducing agent. With the appearance of such ternary heterostructures, the in-plane thermal conductivity of CNF/Ag-PDA-ND composite papers is high up to 16.36 W m(-1) K-1 with about 1202% enhancement, compared to that of pure CNF. Meanwhile, the flexible CNF/Ag-PDA-ND composite papers are also endowed with high strength and toughness. Therefore, interfacial engineering can be extended to diverse materials (e.g., metallic oxides, carbon, and polymers) and can open creative avenues for sustainable high-performance TMMs in advanced high-power electronics.
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