Journal
POLYMERS
Volume 12, Issue 9, Pages -Publisher
MDPI
DOI: 10.3390/polym12091954
Keywords
composites; epoxy; boron nitride; SAC305; thermal conductivity; 3D structure; coalescence
Categories
Funding
- Industrial Technology Innovation Program [20011165]
- Ministry of Trade, Industry & Energy (MOTIE, Korea)
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In this study, hybrid fillers of spherically shaped aggregated boron nitride (a-BN) attached with SAC305, were fabricated via simple stirring and the vacuum filtration method. a-BN was used as the primary conductive filler incorporated with epoxy resin, and these fillers were interconnected each other via the coalescence behavior of SAC305 during the thermal curing process. Based on controlled a-BN content (1 g) on 3 g of epoxy, the thermal conductivity of the composite filled with hybrid filler (a-BN:SAC305 = 1:0.5) reached 0.95 W/mK (33 wt%) due to the construction of the 3D filler network, whereas that of composite filled with raw a-BN was only 0.60 W/mK (25 wt%). The thermal conductivity of unfilled epoxy was 0.19 W/mK.
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