4.7 Article

Transferring the structure of paper for mechanically durable superhydrophobic surfaces

Journal

SURFACE & COATINGS TECHNOLOGY
Volume 405, Issue -, Pages -

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2020.126543

Keywords

Superhydrophobic coatings; Paper; PDMS; Nanoparticles; Microstructure

Funding

  1. Research Fund of the Erciyes University [FYL-2020-9870]
  2. Science Academy, Turkey through the Young Scientist Award Program

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The study proposes a universal solution to the limited mechanical durability of nanostructures by transferring the structure of paper to a PDMS film, resulting in a superhydrophobic surface with high levels of mechanical, chemical and thermal stability.
Solution-phase deposition of nanomaterials represents a highly promising technology with strong industrial application potential for the fabrication of superhydmphobic surfaces. An important barrier towards the adaptation of such materials and processes in a broad range of applications is the limited mechanical durability of the nanostructures. Herein, we present a universal solution to this challenge by benefiting from the unique microstructure of paper. Our approach is based on transferring the structure of paper into a target material, to form a mechanical protection layer for nanomaterials that were deposited from solution-phase, i.e. spray-coating. We demonstrate this concept through the transfer of the structure of paper to a free-standing PDMS film using a simple molding process. Spraying a dispersion of alkyl-silane functionalized silica nanoparticles on the structured free-standing film results in a hierarchically structured superhydmphobic surface with a water contact angle of 175 degrees +/- 2 degrees and a sliding angle <2 degrees +/- 1 degrees. The fabricated superhydmphobic surface displays high levels of mechanical, chemical and thermal stability. The robust, inexpensive, scalable, flexible, and environmentally friendly nature of the presented approach may be a key enabler in superhydrophobic coating applications.

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