Dynamic recrystallization behavior andmicrostructure evolution of high-performance Cu-3.28Ni-0.6Si-0.22Zn-0.11Cr-0.04P during hot compression

By means of isothermal compression at temperatures in the range of 650-900 degrees C and strain rates in the range of 0.001-1 s(-1), the dynamic recrystallization behavior and microstructural evolution of a Cu-3.28Ni-0.6Si-0.22Zn-0.11Cr-0.04P (wt%) alloy designed by a machine learning method were investigated. A semiempirical constitutive equation, processing maps and an average activation energy were generated. The microstructure under different conditions and the effect of strain rate on the texture of the alloy at 800-900 degrees C were observed. The results show that the suitable temperature is 800-900 degrees C; when the strain is less than 0.4, the appropriate strain rate is 0.01-0.5 s(-1); and when the strain is greater than 0.4, the appropriate strain rate is below 0.05 s(-1). After deformation at 800 degrees C, the main texture changed from {112}< 111 > of copper to a uniform distribution with the increase in strain rate, but the sample did not have obvious texture after deformation at 850 and 900 degrees C. The above results can provide a reference for the selection of process parameters.

Automated summary

This study investigated the dynamic recrystallization behavior and microstructural evolution of a Cu alloy designed by a machine learning method through isothermal compression at temperatures in the range of 650-900 degrees C and strain rates in the range of 0.001-1 s(-1). The results suggest a suitable temperature range of 800-900 degrees C and appropriate strain rates dependent on the magnitude of strain. Observations of microstructure and texture changes under different conditions provide guidance for selecting process parameters.