Journal
POLYMER
Volume 212, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.polymer.2020.123115
Keywords
Polyimide; Polyamic acid; Silica microparticles; Porous structure; Electron tomography; Porosity; Dielectric constant; Bruggeman model
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Funding
- Japan Society for the Promotion of Science (JSPS) KAKENKI, Japan [19H00905]
- Japan Science and Technology Agent (JST) Core Research for Evolutional Science and Technology (CREST), Japan [JPMJCR1993]
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Porous polyimide (PI) thin films were successfully fabricated using silica microparticles as a template, resulting in a significant decrease in dielectric constant and further reduction in c value. The relationship between c value and porosity could be accurately reproduced by Bruggeman model.
Porous polyimide (PI) thin films have been fabricated successfully by using silica microparticles (MPs) with different particle sizes as a template, and the three dimensional porous structure has been observed clearly by mean of transmission electron microtomography. The measured values of dielectric constant (epsilon) decreased remarkably by introducing a porous structure, compared with ordinary PI thin films. Especially, the porosity evidently increased (ca. 10%) by suitably employing silica MPs having different particle sizes, and then the value of c was further reduced. Bruggeman model could reproduce nearly the relationship between the value of c and porosity.
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