Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 29, Issue 5, Pages 769-775Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2020.3007072
Keywords
Microvalves; Cooling; Heating systems; Bonding; Silicon; Etching; Thermal management; active liquid cooling; microfluidics; microvalves; thermal buckling; microchannels
Categories
Funding
- European community's Horizon 2020 program [688564]
- Ministere de l'Economie et de l'Innovation du Quebec
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We demonstrated the implementation and self-adaptive behavior of an array of thermostatic microvalves that locally control the water-cooling flow to prevent hot spots in microelectronics while minimizing the pumping power. This strategy enables the compact integration of multiple chips on an interposer without constraints of overheating or thermal cross talk. The performance of microfluidic cell array with self-adaptive valve is assessed experimentally, and compared to other conventional microchannel cooling device showing high efficiency and temperature uniformity. This paper presents the first MEMS implementation and experimental demonstration of this concept, which is part of the STREAMS European project. [2020-0198]
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